ASIC (Application-Specific Integrated Circuit) Solutions on ICGOODFIND SiteMap
最新文章
- NVIDIA AI Servers to Rise >15% in Early 2027 – Memory Costs Bite Into Pricing
- Samsung Eyes Record $79B Shareholder Payout – 110 Trillion Won Buyback & Dividend Plan
- Cypress Semiconductor Chip Selection Guide｜FRAM, USB Controller & PSoC Programmable SoC Overview
- Microchip Q1 FY2027 Tops Guidance – Revenue Surges 38% as Inventory Clears
- Datang Semiconductor Stake Relisted at 60% Discount – $1.2M for 25% Share</span>
- ASE Secures $1.56B Syndicated Loan – Advanced Packaging Capacity Gets Major Boost
- 2026 IC Supplier Risk Matrix: Lead Time Delay & Price Hike Risk Ranking of Major Chip Vendors
- ST’s New 3A Isolated Gate Driver Family Simplifies SiC and IGBT Power Design
- Second‑Gen PolarFire FPGA Bridge Slashes Size 60% for Edge AI Sensor Fusion
- SK Hynix Becomes Kioxia’s Top Shareholder via Convertible Bonds – But Voting Rights Blocked
- ST’s New Automotive StripFET F8 MOSFET – 0.59mΩ RDS(on) for High‑Density Power
- DRAM Shortage Traps $1B Apple A20 Pro Chips at TSMC – Packaging Stalled
- China's MEMS Mirror Leader Zhixin Sensor Secures State-Backed Funding – OCS Optical Switching Heats Up
- Foxconn July Revenue Breaks NT$900B – AI Servers Fuel Historic High
- U.S. Plans Polysilicon Price Floor and Tariffs Under Section 232 – Targeting Semiconductor & Solar Supply Chains
- Memory Prices Hit All-Time Highs in July – Q3 Contract Hikes Slow to 15-20%
- AMEC Targets 60% of High-End Semiconductor Equipment Coverage in 5 Years – Aims for Top Tier by 2035
- Toshiba Rolls Out 40V 120A MOSFET in S-TOGL Package – Low 1.54mΩ RDS(on) for 12V Automotive Systems
- U.S. Awards GlobalFoundries $300M for Silicon Photonics R&D – CPO Push for AI Data Centers
- Acrab Unveils 5nm Edge AI Chip Gelix 1 – 700 TOPS, Runs 100B-Parameter LLMs Locally
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Microchip Acquires Edge AI Chip Firm Hailo – Adds Vision SoCs & AI Accelerators
- STMicro Q2 Revenue Tops $3.49B – AI Data Center Orders Fuel H2 Outlook
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- CXMT LPDDR6 Samples First – 12.8Gbps, Targeting H2 2026 Mass Production
- 3PEAK TPAFEA108 AFE Chip for Optical Modules – 4-Channel IDAC + VDAC with Adaptive Power
- China’s Logic Chips Reach 5nm-Class Performance via DUV Multipatterning, Says SMIC Co-Founder Xie Zhifeng
- China’s First Glass-Substrate CoPoS AI Chip Package Debuts – Xianfeng & Enflame Joint Demo
- PTI & Broadcom Form Singapore JV for Panel-Level Advanced Packaging
- Micron Expands 1γ LPDDR5X Lineup with 6GB, 12GB, 24GB Non-Binary Options
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- TSMC to Hike Mature-Node Wafer Prices – First Adjustment in 3 Years
- China’s AI Hardware Trade Hits RMB 5.13 Trillion in H1 2026 – Up 56.6% YoY
- Muxi Shares Hit RMB 1,000 Then Deny Order Rumors – GPU Unicorn Still Unprofitable
- AMD Confirms Zen 6 Launch at Advancing AI 2026 – July 22-23
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- Lithium Battery and Radar Pioneers Win China’s Top Science Award
- Samsung Lands Neuralink Chip Order – Expands Musk Partnership into Biochips
- onsemi LB1948MC-AH Low-Voltage, Low-Saturation Bidirectional Motor Driver IC
- Onsemi H11L1SR2M High-Speed Optocoupler for Noise-Immune Circuit Design
- onsemi NCV317MABSTT3G 5 A, Adjustable Output, Low-Dropout Voltage Regulator
- Designing a High-Performance Flyback Converter Using the onsemi NCP12700BDNR2G PWM Controller
- onsemi NBA3N011SSNT1G: Ultra-Low-Voltage High-Performance Differential Amplifier
- onsemi NTZD5110NT1G Dual-Channel ESD Protection Zener Diode for High-Speed Data Interfaces
- onsemi MBRS3100T3G Schottky Barrier Rectifier: Datasheet, Application Circuit, and Replacement Guide
- Onsemi FDS4935BZ Dual N-Channel PowerTrench MOSFET: Datasheet, Applications, and Circuit Design Considerations
- Kioxia & SanDisk Ship BiCS10 332-Layer 3D NAND Samples – 59% Density Jump
- ZTE Microelectronics Invests RMB 100M to Establish Nanjing Semiconductor Subsidiary
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Etched Solves AI Throttling with Low-Voltage Design – SRAM+HBM, 80%+ Utilization on Sparse MoE
- Tata Electronics Hit by 630GB Cyber Breach – Apple & Tesla Blueprints Dumped on Dark Web
- onsemi to Acquire Synaptics in $7B All‑Stock Deal, Expanding Edge AI Footprint
- TI Launches Integrated GaN Buck‑Boost Converters for High‑Power Density
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- China’s Largest Automotive Chip Test Center Launches in Shanghai Lingang
- Micron and Anthropic Forge AI Infrastructure Partnership Across HBM, DRAM, and Equity
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- Intel and AMD Unite on ACE AI Compute Extension, Boosting x86 AI Performance Up to 16x
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- NXP’s SAF8444 Single‑Chip Radar Brings ADAS to Entry‑Level EVs
- Li Auto’s Mach M100 Dataflow Chip Hits 1280 TOPS, Outperforms Nvidia ThorU
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- TSMC 3nm Capacity Hits 175K Wafers/Month Yet Still Tight, H2 Price Hike Up to 15%
- AWS Launches Graviton5: 3nm, 192 Cores, DDR5‑8800, PCIe Gen 6 – First 3nm Cloud Arm CPU
- Jiangbolong VP Files for $31M Stock Sale After 840% Rally – Second Stake Reduction
- China GPU ‘Four Dragons’ Member Enflame Nears STAR Market IPO Hearing, Targets $825M Raise
- Shenzhen Huaqiang Confirms Price Hikes on Some HiSilicon Chips, Sees Broad Component Upturn
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- Shenzhen University Launches Integrated Circuit School to Boost Chip Talent Pipeline
- Broadcom Q2 Net Income Soars 87.5% to $9.31B, AI Revenue Up 143%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Synopsys Rolls Out TSMC N6C/N4C IP Portfolio for Cost‑Optimized AI Chips
- Quad XOR Gate: NXP 74AHC86PW,118 Datasheet and Application Overview
- NXP 74AVC8T245BQ,118: An 8-Bit Dual-Supply Bidirectional Voltage Level Translator with 3-State Outputs
- NXP 74HC04DB: A Comprehensive Technical Overview of the High-Speed CMOS Hex Inverter IC
- Qualcomm Rolls Out IQ10 Robot Reference Design with up to 700 TOPS for Industrial and Humanoid Bots
- NXP 2PA1774Q: A Comprehensive Technical Overview of the General-Purpose PNP Transistor
- NXP 74AUP1GU04GM: A Comprehensive Technical Overview of the Advanced Low-Power Inverter
- NXP 74AVC16374DGG: A 16-Bit Edge-Triggered D-Type Flip-Flop for High-Speed, Low-Voltage System Design
- NXP 2PB710ASL: A High-Performance Dual-Band Low-Noise Amplifier for Next-Generation Wireless Systems
- NXP 2PD601ASL: A Comprehensive Overview of Its Features and Applications
- Nvidia N1 Series Arm SoC Specs Leak: N1X and N1 Chips for PC Platform
- Samsung Delivers Industry’s First 12‑Stack HBM4E Samples: 48GB, 3.6TB/s
- ChangXin Memory IPO Clears STAR Market Review, Plans $4.1B Raise
- Kingboard Laminate Raises PCB Material Prices by up to 20% as Raw Material Costs Bite
- NXP IP4221CZ6-S: A Comprehensive Technical Overview of its ESD Protection and USB Interface Design
- NXP BT134-800E: A Comprehensive Technical Overview of the 800V Snubberless Triac
- NXP TEF6635HW/V105: A Comprehensive Technical Overview of its Architecture and Automotive Applications
- Dual Inverter Gate IC: A Comprehensive Guide to the NXP 74HC2G14GV
- NXP TDA18273HN/C1: Advanced Silicon Tuner for Next-Generation Digital TV and Set-Top Box Applications
- NXP TJA1041AT/VM: A High-Performance CAN Transceiver for Automotive Network Systems
- NXP PESD5V0S1BLD: A Comprehensive Guide to the 5V ESD Protection Diode
- The NXP 74HC04: A Comprehensive Guide to the Hex Inverter IC
- Domestic MEMS Chip‑Level Fan Cools CPU with Near‑Zero Noise – China’s Thermal Breakthrough
- Samsung’s Non‑Chip Workers Seek Court Order Over Vast Pay Gap vs Semiconductor Staff
- Unigroup Guoxin Buys Raynen Semiconductor for $263M to Boost Power Semi IDM
- TSMC Targets Panel‑Level Packaging with CoPoS Platform, Mass Production by 2028
- US FTC Launches Antitrust Probe into Arm Over Licensing Practices